• Aluminum Laser Equipment Cold Plate Chill Plate Optical Fiber Cold Plates
Aluminum Laser Equipment Cold Plate Chill Plate Optical Fiber Cold Plates

Aluminum Laser Equipment Cold Plate Chill Plate Optical Fiber Cold Plates

Thông tin chi tiết sản phẩm:

Nguồn gốc: Đông Hoản, Quảng Đông, Trung Quốc
Hàng hiệu: UCHI
Chứng nhận: UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL

Thanh toán:

Số lượng đặt hàng tối thiểu: 1000 CÁI
Giá bán: có thể đàm phán
chi tiết đóng gói: số lượng lớn
Thời gian giao hàng: 5-7 ngày
Điều khoản thanh toán: T / T, Paypal, Western Union, Money gram
Khả năng cung cấp: 5000.000.000 chiếc mỗi tháng
Giá tốt nhất Tiếp xúc

Thông tin chi tiết

Quá trình: vây vẩy hàn Bề mặt hoàn thiện: Mạ niken hoặc anodized
kiểu lắp đặt: Gắn vít Xếp hạng IP: IP65
tùy chọn gắn kết: Lỗ vít hoặc miếng dính Chiều rộng: Theo nhu cầu của khách hàng
Lớp bảo vệ: IP54 Quá trình bổ sung: gia công cnc
Sự đối đãi: thụ độngDẫn nhiệt
Làm nổi bật:

aluminum laser equipment cold plate

,

optical fiber cooling plate

,

liquid cooling plate with warranty

Mô tả sản phẩm

Product parameters of OEM customized aluminum profiles laser equipment cold plate high quality chill plate optical fiber cold plates
OEM

Material: AL 6061

Size:286*275*35mm

Technology: Optical fiber technique+CNC machined

Feature: Good cooling capability and No leakage default

Surface treatment: oil cleared,cleaned and passivation

Heat conducting power: 600W

Aluminum Cooling Plates for Laser Equipment (Cooling Plate, Fiber Laser Cooling Plate)

Aluminum cooling plates, also known as cooling plates or fiber laser cooling plates, are core heat dissipation components for high-power lasers. Mostly made of aluminum alloy, they circulate cooling water through internal flow channels to rapidly remove heat generated by heat sources such as pump sources and gain fibers, ensuring stable laser output and precise wavelength.

1. Core Definition & Application Scenarios

Laser Cooling Plate: A general term for aluminum liquid cooling plates applied to various laser devices (fiber, solid-state, semiconductor), covering power levels from hundreds of watts to tens of kilowatts.
Fiber Laser Cooling Plate: Specially designed for fiber lasers. It realizes temperature equalization and heat dissipation for precise heat sources including pump source arrays, fiber combiners and laser heads, featuring low thermal resistance, excellent temperature uniformity, vibration resistance, insulation and corrosion resistance.
Typical Applications: Industrial cutting/welding fiber lasers (1–6 kW), ultrafast lasers, lidar, medical laser equipment.

2. Material Selection (Mainly Aluminum Alloy)

  • 6061‑T6: The most widely used grade. Thermal conductivity: approx. 180 W/m·K. High strength, easy to machine, available with anodizing/hard anodizing treatment and cost-effective.
  • 3003: Thermal conductivity: approx. 190 W/m·K. Good corrosion resistance and brazeability, commonly used for vacuum brazed cooling plates.
  • 7075: Aerospace-grade alloy with high strength. Thermal conductivity: approx. 130 W/m·K. Applied to compact high-power devices working under severe vibration.
  • Copper-Aluminum Composite: Aluminum substrate embedded with copper flow channels/tubes. Combines light weight and high thermal conductivity (401 W/m·K), ideal for equipment above 2 kW.

3. Main Structures & Manufacturing Processes

3.1 Tube-Embedded Cooling Plate (Most Popular)

Process: Groove milling on aluminum base → Embedding copper tubes → Vacuum brazing / Laser welding → Surface treatment.
Features: Reliable sealing, working pressure 10–15 bar, flexible flow channel design and easy maintenance. Suitable for medium and small-batch production with various specifications.

3.2 Vacuum Brazed Microchannel Cooling Plate

Process: Lamination of multiple aluminum sheets → Diffusion welding / Vacuum brazing → Integral forming.
Features: Dense flow channels, large heat exchange area and superior temperature uniformity (surface temperature difference ≤1℃). Applicable to high-power equipment above 3 kW and mass production.

3.3 Friction Stir Welding (FSW) Cooling Plate

Process: Groove milling on aluminum base → Cover plate fitting → Seamless FSW.
Features: No welding filler required. Weld strength ≥ 90% of base material, low deformation (≤0.1 mm/m) and high pressure resistance. Perfect for scenarios requiring high vibration resistance and long-term reliability.

3.4 Laser Welded Cooling Plate

Process: Laser fusion welding on thin plates (0.8–1.5 mm) to form sealed flow channels.
Features: High machining accuracy and small heat-affected zone. Designed for ultra-thin and miniaturized cooling plates.

4. Key Performance Indicators (Procurement Reference)

  • Thermal Resistance: ≤0.05℃·cm²/W (lower value indicates better performance)
  • Temperature Uniformity: Surface temperature difference ≤1–2℃ (guarantees stable laser power)
  • Pressure Resistance: Operating pressure 6–10 bar; Test pressure 15–20 bar
  • Leak Rate: Helium leak detection ≤1×10⁻⁹ Pa·m³/s (zero leakage standard)
  • Flatness: ≤0.05–0.1 mm/m (ensures tight fitting with components)
  • Surface Treatment: Hard anodizing (layer thickness ≥50 μm, insulated & corrosion-resistant), conductive anodizing, electroless nickel plating.

5. Design Essentials (Dedicated for Fiber Lasers)

  • Flow Channel Layout: Parallel channels for pump source area (low resistance & uniform temperature); Serpentine channels for fiber area (extended heat exchange); Counter-flow design (reduces temperature difference between inlet and outlet).
  • Fiber Groove: Smooth and burr-free with fillet radius R≥0.5 mm to prevent damage to fiber coating.
  • Insulation & Voltage Resistance: Anodized layer thickness ≥50 μm; Withstand voltage ≥2 kV (prevents electric leakage of pump sources).
  • Vibration Reinforcement: Reinforced mounting holes; Flow channels arranged away from high-stress areas to adapt to vibration in industrial sites.

6. Performance Comparison: Aluminum vs Copper

Aluminum Cooling Plate: Light weight (about 1/3 of copper), low cost (about 1/2 of copper), easy to machine and excellent anodic insulation. Slightly lower thermal conductivity (180 W/m·K vs 401 W/m·K). Suitable for medium & low-power equipment, lightweight designs and cost-sensitive projects.
Copper Cooling Plate: Extremely high thermal conductivity and outstanding heat dissipation capacity. Drawbacks: heavy weight, high cost, difficult machining and prone to oxidation. Applied to ultra-high-power equipment (≥6 kW), compact spaces and scenarios demanding extreme heat dissipation.

7. Common Specifications (Customizable)

  • Dimensions: Length 200–800 mm, Width 100–400 mm, Thickness 8–20 mm
  • Flow Channel: Width 3–8 mm, Height 2–5 mm, Pitch 5–15 mm
  • Connectors: Standard G1/4, G3/8, M14×1.5 or customized quick connectors

8. Selection Guidelines

  • ≤1.5 kW: 6061 alloy with embedded copper tubes & laser welding, high cost performance
  • 1.5–3 kW: 6061/3003 vacuum brazed microchannel type, good temperature uniformity and high reliability
  • ≥3 kW: Copper-aluminum composite or vacuum brazed type, low thermal resistance and high pressure resistance
  • High vibration / Outdoor use: Friction stir welding + hard anodizing, high structural strength and corrosion resistance
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